Invention Grant
US08684256B2 Method for hermetically joining plate and shaft devices including ceramic materials used in semiconductor processing
有权
用于密封连接板和轴装置的方法,包括用于半导体加工的陶瓷材料
- Patent Title: Method for hermetically joining plate and shaft devices including ceramic materials used in semiconductor processing
- Patent Title (中): 用于密封连接板和轴装置的方法,包括用于半导体加工的陶瓷材料
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Application No.: US13681930Application Date: 2012-11-20
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Publication No.: US08684256B2Publication Date: 2014-04-01
- Inventor: Alfred Grant Elliot , Brent Donald Alfred Elliot , Frank Balma , Richard Erich Schuster , Dennis George Rex , Alexander Veyster
- Applicant: Component Re-Engineering Company, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Component Re-Engineering Company, Inc.
- Current Assignee: Component Re-Engineering Company, Inc.
- Current Assignee Address: US CA Santa Clara
- Agent Michael A. Guth
- Main IPC: B23K31/02
- IPC: B23K31/02

Abstract:
A method for the joining of ceramic pieces with a hermetically sealed joint comprising brazing a continuous layer of joining material between the two pieces. The wetting and flow of the joining material is controlled by the selection of the joining material, the joining temperature, the time at temperature, the joining atmosphere, and other factors. The ceramic pieces may be aluminum nitride and the pieces may be brazed with an aluminum alloy under controlled atmosphere. The joint material is adapted to later withstand both the environments within a process chamber during substrate processing, and the oxygenated atmosphere which may be seen within the shaft of a heater or electrostatic chuck.
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