Invention Grant
US08683880B2 Semiconductor wafer metrology apparatus and method 有权
半导体晶圆计量仪器及方法

  • Patent Title: Semiconductor wafer metrology apparatus and method
  • Patent Title (中): 半导体晶圆计量仪器及方法
  • Application No.: US12680756
    Application Date: 2008-09-30
  • Publication No.: US08683880B2
    Publication Date: 2014-04-01
  • Inventor: Robert John Wilby
  • Applicant: Robert John Wilby
  • Applicant Address: GB Bristol
  • Assignee: Metryx Limited
  • Current Assignee: Metryx Limited
  • Current Assignee Address: GB Bristol
  • Agency: Stites & Harbison PLLC
  • Agent Douglas E. Jackson
  • Priority: GB0719469.9 20071004
  • International Application: PCT/GB2008/003301 WO 20080930
  • International Announcement: WO2009/044121 WO 20090409
  • Main IPC: G01G9/00
  • IPC: G01G9/00
Semiconductor wafer metrology apparatus and method
Abstract:
A semiconductor wafer metrology technique which corrects for the effect of electrostatic forces on an atmospheric buoyancy compensated weight force measurement of a semiconductor wafer. In one aspect a wafer is weighed in a faraday cage whose is measured independently. A change in the measured weight of the faraday cage can be used to correct the measure weight the wafer. In another aspect a direct electrostatic measurement can be converted into a weight correction using a predetermined correlation between an electrostatic charge measured by the charge meter and a weight error force. In another aspect the electrostatic measurement may be indirect, e.g. derived from varying the distance between the wafer and a grounded plate parallel to the wafer to effect a change in an electrostatic force between the grounded plate and the wafer.
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