Invention Grant
- Patent Title: Semiconductor wafer metrology apparatus and method
- Patent Title (中): 半导体晶圆计量仪器及方法
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Application No.: US12680756Application Date: 2008-09-30
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Publication No.: US08683880B2Publication Date: 2014-04-01
- Inventor: Robert John Wilby
- Applicant: Robert John Wilby
- Applicant Address: GB Bristol
- Assignee: Metryx Limited
- Current Assignee: Metryx Limited
- Current Assignee Address: GB Bristol
- Agency: Stites & Harbison PLLC
- Agent Douglas E. Jackson
- Priority: GB0719469.9 20071004
- International Application: PCT/GB2008/003301 WO 20080930
- International Announcement: WO2009/044121 WO 20090409
- Main IPC: G01G9/00
- IPC: G01G9/00

Abstract:
A semiconductor wafer metrology technique which corrects for the effect of electrostatic forces on an atmospheric buoyancy compensated weight force measurement of a semiconductor wafer. In one aspect a wafer is weighed in a faraday cage whose is measured independently. A change in the measured weight of the faraday cage can be used to correct the measure weight the wafer. In another aspect a direct electrostatic measurement can be converted into a weight correction using a predetermined correlation between an electrostatic charge measured by the charge meter and a weight error force. In another aspect the electrostatic measurement may be indirect, e.g. derived from varying the distance between the wafer and a grounded plate parallel to the wafer to effect a change in an electrostatic force between the grounded plate and the wafer.
Public/Granted literature
- US20100206098A1 SEMICONDUCTOR WAFER METROLOGY APPARATUS AND METHOD Public/Granted day:2010-08-19
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