Invention Grant
US08683867B2 Pressure sensor package having a groove provided in a wall surface of the pressure inlet pipe
失效
压力传感器封装,其具有设置在压力入口管的壁表面中的槽
- Patent Title: Pressure sensor package having a groove provided in a wall surface of the pressure inlet pipe
- Patent Title (中): 压力传感器封装,其具有设置在压力入口管的壁表面中的槽
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Application No.: US13243176Application Date: 2011-09-23
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Publication No.: US08683867B2Publication Date: 2014-04-01
- Inventor: Kimihiro Ashino
- Applicant: Kimihiro Ashino
- Applicant Address: JP
- Assignee: Fuji Electric Co., Ltd.
- Current Assignee: Fuji Electric Co., Ltd.
- Current Assignee Address: JP
- Agency: Rossi, Kimms & McDowell LLP
- Priority: JP2010-216968 20100928
- Main IPC: G01L7/00
- IPC: G01L7/00 ; G01L9/00

Abstract:
An aspect of a pressure sensor package is that a condensed droplet can be prevented from solidifying and blocking the hole of a pressure inlet pipe, without increasing the external dimensions of the package. Aspects of the invention include a groove in a wall surface of a hole of a pressure inlet pipe, a droplet condensed on the wall surface spreads along the groove by a capillary action, and it is possible to prevent the hole of the pressure inlet pipe being blocked by the droplet.
Public/Granted literature
- US20120073381A1 PRESSURE SENSOR PACKAGE Public/Granted day:2012-03-29
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