Invention Grant
- Patent Title: Data center flooring arrangements
- Patent Title (中): 数据中心地板布置
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Application No.: US13740304Application Date: 2013-01-14
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Publication No.: US08683762B2Publication Date: 2014-04-01
- Inventor: Jean-Michel Rodriquez , Emmanuel Tong-Viet
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Hoffman Warnick LLC
- Agent Jean S. Sullivan
- Priority: EP12305401 20120404
- Main IPC: E04C2/52
- IPC: E04C2/52
Abstract:
A barrier element for forming a component of a floor covering of a floor in a data center includes a substantially laminar part, the laminar part having a cross member attached to one surface. The cross member mounts a plurality of filaments which can form a layer impervious to air flow.
Public/Granted literature
- US20130263539A1 DATA CENTER FLOORING ARRANGEMENTS Public/Granted day:2013-10-10
Information query
IPC分类:
