Invention Grant
US08676362B2 Encapsulation of high definition audio data over an input/output interconnect
有权
通过输入/输出互连封装高分辨率音频数据
- Patent Title: Encapsulation of high definition audio data over an input/output interconnect
- Patent Title (中): 通过输入/输出互连封装高分辨率音频数据
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Application No.: US11853149Application Date: 2007-09-11
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Publication No.: US08676362B2Publication Date: 2014-03-18
- Inventor: Douglas Gabel , David Harriman
- Applicant: Douglas Gabel , David Harriman
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Blakely, Sokoloff, Taylor & Zafman LLP
- Main IPC: G06F17/00
- IPC: G06F17/00

Abstract:
Embodiments of the invention are generally directed to systems, methods, and apparatuses for encapsulation of high definition audio data over an input/output interconnect. In some embodiments, a system includes tunneling logic coupled with a high definition (HD) audio controller. The tunneling logic may receive digital audio data from the HD audio controller, encapsulate the digital audio data in a message suitable for an in-band input/output (IO) interconnect, and send the message to an add-in graphics card via the in-band input/output IO interconnect. Other embodiments are described and claimed.
Public/Granted literature
- US20090069910A1 ENCAPSULATION OF HIGH DEFINITION AUDIO DATA OVER AN INPUT/OUTPUT INTERCONNECT Public/Granted day:2009-03-12
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