Invention Grant
- Patent Title: Ear-muff type headset for two-way communication
- Patent Title (中): 耳罩型耳机用于双向通信
-
Application No.: US12996444Application Date: 2009-09-02
-
Publication No.: US08675897B2Publication Date: 2014-03-18
- Inventor: Mikio Fukuda , Tomoya Atsumi , Shouji Fujino
- Applicant: Mikio Fukuda , Tomoya Atsumi , Shouji Fujino
- Applicant Address: JP
- Assignee: Temco Japan Co., Ltd.
- Current Assignee: Temco Japan Co., Ltd.
- Current Assignee Address: JP
- Agency: Schmeiser, Olsen & Watts, LLP
- Priority: JP2008-227238 20080904
- International Application: PCT/JP2009/004319 WO 20090902
- International Announcement: WO2010/026746 WO 20100311
- Main IPC: H04R1/00
- IPC: H04R1/00

Abstract:
It is an object of the invention to provide a headset for performing simultaneous two-way communication or alternate two-way communication, which has excellent sound insulating properties such that external noise is not possibly mixed even when used under high noise conditions. A pair of bowl-shaped housings 1 each having an annular pad 2 attached to the rim of an opening portion are connected together through a headband 3, an acoustic speaker 5 supported by a buffer material 4 is arranged in at least one of the housings 1, and a bone conduction microphone 6 supported by the buffer material 4 such that the distal end is brought into abutment against the ear or the portion around the ear when a user wears the headset is arranged in at least one of the housings 1.
Public/Granted literature
- US20110170718A1 EAR-MUFF TYPE HEADSET FOR TWO-WAY COMMUNICATION Public/Granted day:2011-07-14
Information query