Invention Grant
- Patent Title: Thermal conductors in electronic devices
- Patent Title (中): 电子设备中的导热体
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Application No.: US13191071Application Date: 2011-07-26
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Publication No.: US08675363B2Publication Date: 2014-03-18
- Inventor: Wilhelmus Crooijmans , Joshua Een
- Applicant: Wilhelmus Crooijmans , Joshua Een
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Agent Benjamin M. Searle
- Main IPC: H05K7/20
- IPC: H05K7/20

Abstract:
In one implementation, an electronic device includes a first body portion, a second body portion movably coupled to the first body portion, a heat source, and a thermal conductor in thermal communication with the heat source. The heat source is disposed within one of the first body portion or the second body portion. The thermal conductor has a first end portion, a second end portion, and a flexible portion between the first end portion and the second end portion. The first end portion of the thermal conductor is disposed within the first body portion. The second end portion of the thermal conductor is disposed within the second body portion.
Public/Granted literature
- US20130027886A1 THERMAL CONDUCTORS IN ELECTRONIC DEVICES Public/Granted day:2013-01-31
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