Invention Grant
- Patent Title: Conductive paste for external electrode, multilayered ceramic electronic component using the same and fabrication method thereof
- Patent Title (中): 外部电极用导电膏,使用其的多层陶瓷电子元件及其制造方法
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Application No.: US13407219Application Date: 2012-02-28
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Publication No.: US08675343B2Publication Date: 2014-03-18
- Inventor: Myung Jun Park , Sung Bum Sohn , Hyun Hee Gu , Chang Hoon Kim , Sang Hoon Kwon
- Applicant: Myung Jun Park , Sung Bum Sohn , Hyun Hee Gu , Chang Hoon Kim , Sang Hoon Kwon
- Applicant Address: KR Gyunggi-Do
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Gyunggi-Do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2011-0091234 20110908
- Main IPC: H01G4/06
- IPC: H01G4/06 ; H01G4/228 ; H01G5/01 ; H01B1/02

Abstract:
There are provided a conductive paste for an external electrode, a multilayered ceramic electronic component using the same, and a fabrication method thereof. The conductive paste for external electrode includes: a conductive metal; and a conductive amorphous metal including a (Cu, Ni)-bZr-c(Al, Sn) that satisfies conditions of a+b+c=100, 20≦a≦60, 20≦b≦60, and 2≦c≦25. A degradation of connectivity between external electrodes and internal electrodes and defective plating due to a glass detachment may be solved.
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