Invention Grant
US08675077B2 Alignment metrology and resolution measurement system for imaging arrays
有权
用于成像阵列的对准度量和分辨率测量系统
- Patent Title: Alignment metrology and resolution measurement system for imaging arrays
- Patent Title (中): 用于成像阵列的对准度量和分辨率测量系统
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Application No.: US12178488Application Date: 2008-07-23
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Publication No.: US08675077B2Publication Date: 2014-03-18
- Inventor: Henry A. Hill , David W. Gardner
- Applicant: Henry A. Hill , David W. Gardner
- Applicant Address: US OR Wilsonville
- Assignee: Flir Systems, Inc.
- Current Assignee: Flir Systems, Inc.
- Current Assignee Address: US OR Wilsonville
- Agency: Haynes and Boone, LLP
- Main IPC: H04N17/00
- IPC: H04N17/00 ; H04N17/02 ; H04N3/14 ; H04N5/335 ; H04N5/225 ; G02B13/16

Abstract:
An alignment metrology and resolution measurement system concurrently determines the alignment of an imaging array in six degrees of freedom relative to an external reference frame, and further determines the resolution of the imaging array. To achieve this, an image of at least three mask patterns is projected on the imaging array. First and second positions of the imaging array relative to first and second coordinate axis of the reference frame is obtained using pixel positions of the images along the first and second axis. A first rotational position of the imaging array about a third coordinate axis is obtained using pixel positions of the images along the first and second axes. The third position and the second and third rotational positions of the imaging array about the first and second coordinate axis are determined using feature widths of focus images of the patterns and distances between the mask patterns.
Public/Granted literature
- US20100020180A1 ALIGNMENT METROLOGY AND RESOLUTION MEASUREMENT SYSTEM FOR IMAGING ARRAYS Public/Granted day:2010-01-28
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