Invention Grant
- Patent Title: Audio/video channel bonding architecture
- Patent Title (中): 音频/视频通道绑定架构
-
Application No.: US13673028Application Date: 2012-11-09
-
Publication No.: US08667548B2Publication Date: 2014-03-04
- Inventor: Xuemin Chen , Rajesh Shankarrao Mamidwar , Anand Tongle , Victor Hou
- Applicant: Broadcom Corporation
- Applicant Address: US CA Irvine
- Assignee: Broadcom Corporation
- Current Assignee: Broadcom Corporation
- Current Assignee Address: US CA Irvine
- Agency: Brinks Gilson & Lione
- Main IPC: H04N7/173
- IPC: H04N7/173

Abstract:
Different data communication architectures deliver a wide variety of content, including audio and video content, to consumers. The architectures employ channel bonding to deliver more bandwidth than any single communication channel can carry. In some implementations, the communication architectures distribute video programming in the form of MPEG2 TS packets, flagged by marker packets, in a round-robin manner across the communication channels. Channel bonding synchronization information may be present in packets defined above the data-link layer or added to fields within data-link layer frames.
Public/Granted literature
- US20130239161A1 Audio/Video Channel Bonding Architecture Public/Granted day:2013-09-12
Information query