Invention Grant
- Patent Title: High frequency signal interpolating apparatus
- Patent Title (中): 高频信号插值装置
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Application No.: US12311367Application Date: 2007-10-16
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Publication No.: US08666732B2Publication Date: 2014-03-04
- Inventor: Yasushi Sato , Atsuko Ryu
- Applicant: Yasushi Sato , Atsuko Ryu
- Applicant Address: JP Fukuoka
- Assignee: Kyushu Institute of Technology
- Current Assignee: Kyushu Institute of Technology
- Current Assignee Address: JP Fukuoka
- Agency: Rader, Fishman & Grauer PLLC
- Priority: JP2006-282830 20061017
- International Application: PCT/JP2007/070174 WO 20071016
- International Announcement: WO2008/047793 WO 20080424
- Main IPC: G10L19/02
- IPC: G10L19/02 ; H03K5/24

Abstract:
A high frequency signal interpolation apparatus provides, with a simple structure, a high-quality digital audio signal through interpolation of high frequency signals missing due to compression. The high frequency signal interpolation apparatus includes a peak value detection and holding circuit configured to detect a peak value of a digital audio signal provided to an input terminal by sampling the digital audio signal and generate a square wave signal by holding the detected peak value; a high-pass filter configured to extract a higher harmonic component from the generated square wave signal; and an adder configured to add the extracted higher harmonic component to the digital audio signal provided to the input terminal.
Public/Granted literature
- US20100023333A1 High frequency signal interpolating method and high frequency signal interpolating Public/Granted day:2010-01-28
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