An image-pickup apparatus includes an image-pickup element, a first wiring substrate where the image-pickup element is mounted, a second wiring substrate which is electrically connected with the first wiring substrate and a structure which has electrical conductivity. The first wiring substrate has a first wiring portion where a differential signal line is formed and a second wiring portion where a power-supply line is formed, a ground portion is formed on at least one surface of the first and second wiring portion which faces each other, the first wiring substrate is bended so that at least parts of the first and second wiring portion are overlapped with each other and the ground portion is located between the differential signal line and the power-supply line, and the bended first wiring substrate is arranged in the structure so that the second wiring portion is located between the first wiring portion and the structure.