Invention Grant
US08665170B2 Antenna assembly having multiple antenna elements with hemispherical coverage
有权
具有半球形覆盖的多个天线元件的天线组件
- Patent Title: Antenna assembly having multiple antenna elements with hemispherical coverage
- Patent Title (中): 具有半球形覆盖的多个天线元件的天线组件
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Application No.: US12164911Application Date: 2008-06-30
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Publication No.: US08665170B2Publication Date: 2014-03-04
- Inventor: Bruce Foster Bishop , Luis Cardenas
- Applicant: Bruce Foster Bishop , Luis Cardenas
- Applicant Address: US PA Berwyn
- Assignee: Tyco Electronics Corporation
- Current Assignee: Tyco Electronics Corporation
- Current Assignee Address: US PA Berwyn
- Main IPC: H01Q5/01
- IPC: H01Q5/01 ; H01Q21/20 ; H01Q9/38

Abstract:
An antenna assembly includes a cable assembly having at least one wire and a circuit board assembly having a ground plane and a plurality of mounting locations. The wire(s) is electrically connected to corresponding mounting locations. A plurality of antenna elements are mounted to the circuit board at corresponding mounting locations. Each antenna element has a feed finger and a ground finger, where the ground finger is electrically connected to the ground plane and the feed finger is electrically connected to the corresponding wire. Each antenna element has a first portion extending from the circuit board along a first plane and a second portion extending from the first portion along a second plane that is transverse to the first plane. Each antenna element provides hemispherical coverage and wide frequency bandwidth.
Public/Granted literature
- US20090322648A1 ANTENNA ASSEMBLY HAVING MULTIPLE ANTENNA ELEMENTS WITH HEMISPHERICAL COVERAGE Public/Granted day:2009-12-31
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