There is established an easier inspection method with which it is not required to set up probes on wires. Also, there is provided an inspection apparatus using this inspection method. With the inspection apparatus or inspection method, primary coils of an inspection substrate and secondary coils of a device substrate are superimposed on each other so that a certain space is maintained therebetween. An AC signal is inputted into the primary coils, thereby generating an electromotive force in each secondary coil by electromagnetic induction. Then, each circuit provided on the device substrate is driven using the electromotive force and information possessed by an electromagnetic wave or electric field generated in this circuit is monitored, thereby detecting each defective spot.