Invention Grant
- Patent Title: Acoustic wave device
- Patent Title (中): 声波装置
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Application No.: US13712218Application Date: 2012-12-12
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Publication No.: US08664835B2Publication Date: 2014-03-04
- Inventor: Satoru Matsuda , Takashi Matsuda , Michio Miura
- Applicant: Taiyo Yuden Co., Ltd.
- Applicant Address: JP Tokyo
- Assignee: Taiyo Yuden Co., Ltd.
- Current Assignee: Taiyo Yuden Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Chen Yoshimura LLP
- Priority: JP2010-195020 20100831
- Main IPC: H03H9/02
- IPC: H03H9/02
Abstract:
An acoustic wave device includes: an electrode that excites an acoustic wave and is located on a substrate; and a silicon oxide film that is located so as to cover the electrode and is doped with an element or molecule displacing O in a Si—O bond, wherein the element or molecule is F, H, CH3, CH2, Cl, C, N, P, or S.
Public/Granted literature
- US20130099630A1 ACOUSTIC WAVE DEVICE Public/Granted day:2013-04-25
Information query
