Invention Grant
- Patent Title: Semiconductor device with protruding component portion and method of packaging
- Patent Title (中): 具有突出部件的半导体器件和封装方法
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Application No.: US12626411Application Date: 2009-11-25
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Publication No.: US08664753B2Publication Date: 2014-03-04
- Inventor: Teck Sim Lee , Chee Voon Tan , Kwai Hong Wong
- Applicant: Teck Sim Lee , Chee Voon Tan , Kwai Hong Wong
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Dicke, Billig & Czaja, PLLC
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L21/66 ; H01L21/00
Abstract:
A semiconductor package device having a protruding component portion and a method of packaging the semiconductor device is disclosed. The semiconductor device has a component, such as a leadframe, and a packaging mold body. The packaging mold body is formed around a portion of the component and a recess is formed in the packaging mold body adjacent the protruding portion of the component to prevent the protruding portion of the component from damaging other adjacent and abutting semiconductor devices.
Public/Granted literature
- US20110121439A1 SEMICONDUCTOR DEVICE WITH PROTRUDING COMPONENT PORTION AND METHOD OF PACKAGING Public/Granted day:2011-05-26
Information query
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