Invention Grant
- Patent Title: Semiconductor device, method of manufacturing the same and power-supply device using the same
- Patent Title (中): 半导体装置及其制造方法以及使用其的电源装置
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Application No.: US12818485Application Date: 2010-06-18
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Publication No.: US08664716B2Publication Date: 2014-03-04
- Inventor: Takayuki Hashimoto , Takashi Hirao , Noboru Akiyama
- Applicant: Takayuki Hashimoto , Takashi Hirao , Noboru Akiyama
- Applicant Address: JP Kawasaki-shi
- Assignee: Renesas Electronics Corporation
- Current Assignee: Renesas Electronics Corporation
- Current Assignee Address: JP Kawasaki-shi
- Agency: Brundidge & Stanger, P.C.
- Priority: JP2009-149783 20090624
- Main IPC: H01L27/06
- IPC: H01L27/06

Abstract:
In a lateral-type power MOSFET, high breakdown voltage is achieved with suppressing to increase a cell pitch, and a feedback capacity and an ON resistance are decreased. An n− type silicon region having a high resistance to be a region of maintaining a breakdown voltage is vertically provided with respect to a main surface of an n+ type silicon substrate, and the n− type silicon region having the high resistance is connected to the n+ type silicon substrate. Also, a conductive substance is filled through an insulating substance inside a trench formed to reach the n+ type silicon substrate from the main surface of the n+ type silicon substrate so as to contact with the n− type silicon region having the high resistance, and the conductive substance is electrically connected to a source electrode.
Public/Granted literature
- US20100327348A1 SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE SAME AND POWER-SUPPLY DEVICE USING THE SAME Public/Granted day:2010-12-30
Information query
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