Invention Grant
- Patent Title: Resin composition for optical semiconductor element housing package, and optical semiconductor light-emitting device obtained using the same
- Patent Title (中): 用于光学半导体元件外壳封装的树脂组合物和使用其的光学半导体发光器件
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Application No.: US12875417Application Date: 2010-09-03
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Publication No.: US08664685B2Publication Date: 2014-03-04
- Inventor: Takashi Taniguchi , Takamitsu Ota , Hisataka Ito
- Applicant: Takashi Taniguchi , Takamitsu Ota , Hisataka Ito
- Applicant Address: JP Osaka
- Assignee: Nitto Denko Corporation
- Current Assignee: Nitto Denko Corporation
- Current Assignee Address: JP Osaka
- Agency: Sughrue Mion, PLLC
- Priority: JP2009-205753 20090907
- Main IPC: H01L33/52
- IPC: H01L33/52 ; C08L63/00 ; C08K3/22
Abstract:
The present invention relates to a resin composition for forming an insulating resin layer for optical semiconductor element housing package having a concave portion in which a metal lead frame and an optical semiconductor element mounted thereon are housed, in which the resin composition includes the following ingredients (A) to (D), and the ingredients (C) and (D) are contained in a blend ratio (C)/(D) of 0.3 to 3.0 as a weight ratio thereof: (A) an epoxy resin; (B) an acid anhydride curing agent; (C) a white pigment; and (D) an inorganic filler.
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Information query
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