Invention Grant
- Patent Title: Substrate sheet
- Patent Title (中): 基板
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Application No.: US13819829Application Date: 2011-09-02
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Publication No.: US08664096B2Publication Date: 2014-03-04
- Inventor: Herbert Lifka , Renatus Hendricus Maria Sanders , Denny Mathew
- Applicant: Herbert Lifka , Renatus Hendricus Maria Sanders , Denny Mathew
- Applicant Address: NL Eindhoven
- Assignee: Koninklijke Philips N.V.
- Current Assignee: Koninklijke Philips N.V.
- Current Assignee Address: NL Eindhoven
- Priority: EP10175346 20100906
- International Application: PCT/IB2011/053852 WO 20110902
- International Announcement: WO2012/032446 WO 20120315
- Main IPC: H01L51/00
- IPC: H01L51/00

Abstract:
The invention provides a method for producing a flexible barrier sheet (200) comprising a barrier layer (103) and metallic elements (104), said method comprising: a) providing a metallic layer (102) applied on a polymeric support layer (101), the metallic layer having a first surface (105) facing the polymeric support layer and a second surface (106) facing away from said polymeric support layer; b) providing metallic elements on the second surface of the metallic layer; c) providing a barrier layer covering said second surface of the metallic layer and said metallic elements, the barrier layer having a first surface facing the metallic layer and a second surface facing away from the metallic layer; d) releasing the polymeric support layer from the metallic layer; and e) removing the metallic layer from the metallic elements and the barrier layer. The flexible barrier sheet may be used in roll-to-roll fabrication of thin film semiconductor devices requiring a high quality barrier substrate sheet, such as OLEDs.
Public/Granted literature
- US20130157446A1 SUBSTRATE SHEET Public/Granted day:2013-06-20
Information query
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