Invention Grant
- Patent Title: Method for fabricating field-effect transistor
- Patent Title (中): 制作场效应晶体管的方法
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Application No.: US12983894Application Date: 2011-01-04
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Publication No.: US08664073B2Publication Date: 2014-03-04
- Inventor: Kun-Hsien Lee , Cheng-Tung Huang , Wen-Han Hung , Shyh-Fann Ting , Li-Shian Jeng , Meng-Yi Wu , Tzyy-Ming Cheng
- Applicant: Kun-Hsien Lee , Cheng-Tung Huang , Wen-Han Hung , Shyh-Fann Ting , Li-Shian Jeng , Meng-Yi Wu , Tzyy-Ming Cheng
- Applicant Address: TW Science-Based Industrial Park, Hsin-Chu
- Assignee: United Microelectronics Corp.
- Current Assignee: United Microelectronics Corp.
- Current Assignee Address: TW Science-Based Industrial Park, Hsin-Chu
- Agent Winston Hsu; Scott Margo
- Main IPC: H01L21/8238
- IPC: H01L21/8238

Abstract:
A method for fabricating complimentary metal-oxide-semiconductor field-effect transistor is disclosed. The method includes the steps of: (A) forming a first gate structure and a second gate structure on a substrate; (B) performing a first co-implantation process to define a first type source/drain extension region depth profile in the substrate adjacent to two sides of the first gate structure; (C) forming a first source/drain extension region in the substrate adjacent to the first gate structure; (D) performing a second co-implantation process to define a first pocket region depth profile in the substrate adjacent to two sides of the second gate structure; (E) performing a first pocket implantation process to form a first pocket region adjacent to two sides of the second gate structure.
Public/Granted literature
- US20120009745A1 METHOD FOR FABRICATING FIELD-EFFECT TRANSISTOR Public/Granted day:2012-01-12
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