Invention Grant
- Patent Title: Semiconductor structure and method of fabricating the same
- Patent Title (中): 半导体结构及其制造方法
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Application No.: US13367382Application Date: 2012-02-07
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Publication No.: US08664060B2Publication Date: 2014-03-04
- Inventor: An-Chi Liu , Chun-Hsien Lin , Yu-Cheng Tung , Chien-Ting Lin , Wen-Tai Chiang , Shih-Hung Tsai , Ssu-I Fu , Ying-Tsung Chen , Chih-Wei Chen
- Applicant: An-Chi Liu , Chun-Hsien Lin , Yu-Cheng Tung , Chien-Ting Lin , Wen-Tai Chiang , Shih-Hung Tsai , Ssu-I Fu , Ying-Tsung Chen , Chih-Wei Chen
- Applicant Address: TW Hsin-Chu
- Assignee: United Microelectronics Corp.
- Current Assignee: United Microelectronics Corp.
- Current Assignee Address: TW Hsin-Chu
- Agent Winston Hsu; Scott Margo
- Main IPC: H01L29/78
- IPC: H01L29/78

Abstract:
A semiconductor structure and a method of fabricating the same comprising the steps of providing a substrate, forming at least one fin structure on said substrate, forming a gate covering said fin structure, forming a plurality of epitaxial structures covering said fin structures, performing a gate pullback process to reduce the critical dimension (CD) of said gate and separate said gate and said epitaxial structures, forming lightly doped drains (LDD) in said fin structures, and forming a spacer on said gate and said fin structures.
Public/Granted literature
- US20130200470A1 SEMICONDUCTOR STRUCTURE AND METHOD OF FABRICATING THE SAME Public/Granted day:2013-08-08
Information query
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