Invention Grant
- Patent Title: Integrated circuit tampering protection and reverse engineering prevention coatings and methods
- Patent Title (中): 集成电路篡改保护和逆向工程预防涂层及方法
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Application No.: US13329068Application Date: 2011-12-16
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Publication No.: US08664047B2Publication Date: 2014-03-04
- Inventor: Nathan P. Lower , Alan P. Boone , Ross K. Wilcoxon
- Applicant: Nathan P. Lower , Alan P. Boone , Ross K. Wilcoxon
- Applicant Address: US IA Cedar Rapids
- Assignee: Rockwell Collins, Inc.
- Current Assignee: Rockwell Collins, Inc.
- Current Assignee Address: US IA Cedar Rapids
- Agent Donna P. Suchy; Daniel M. Barbieri
- Main IPC: H01L23/22
- IPC: H01L23/22
Abstract:
A method of protecting an electronics package is discussed along with devices formed by the method. The method involves providing at least one electronic component that requires protecting from tampering and/or reverse engineering. Further, the method includes mixing into a liquid glass material at least one of high durability micro-particles or high-durability nano-particles, to form a coating material. Further still, the method includes depositing the coating material onto the electronic component and curing the coating material deposited.
Public/Granted literature
- US20120088338A1 INTEGRATED CIRCUIT TAMPERING PROTECTION AND REVERSE ENGINEERING PREVENTION COATINGS AND METHODS Public/Granted day:2012-04-12
Information query
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