Invention Grant
- Patent Title: LED lamp strip and manufacturing process thereof
- Patent Title (中): LED灯条及其制造工艺
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Application No.: US13109471Application Date: 2011-05-17
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Publication No.: US08664045B2Publication Date: 2014-03-04
- Inventor: Ming-Te Tu , Mu Tsan Liao
- Applicant: Ming-Te Tu , Mu Tsan Liao
- Applicant Address: TW Taichung
- Assignee: Lingsen Precision Industries, Ltd.
- Current Assignee: Lingsen Precision Industries, Ltd.
- Current Assignee Address: TW Taichung
- Agency: Muncy, Geissler, Olds & Lowe P.C.
- Priority: TW100108327A 20110311
- Main IPC: H01L21/82
- IPC: H01L21/82

Abstract:
A process of manufacturing an LED lamp strip includes the steps of forming a plurality of through holes on an adhesive tape, mounting the adhesive tape to a top side of a scrollable lead frame, bonding a plurality of LED chips to the top side of the scrollable lead frame according to the positions of the through holes, packaging the LED chips respectively, and finally cutting the scrollable lead frame. In light of this, the LED lamp strip can be produced under the circumstances of low production cost and less production time.
Public/Granted literature
- US20120228645A1 LED LAMP STRIP AND MANUFACTURING PROCESS THEREOF Public/Granted day:2012-09-13
Information query
IPC分类: