Invention Grant
- Patent Title: Method of producing a solid-state image sensing device including solid-state image sensor having a pillar-shaped semiconductor layer
- Patent Title (中): 制造具有柱状半导体层的固态图像传感器的固体摄像装置的制造方法
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Application No.: US13101833Application Date: 2011-05-05
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Publication No.: US08664032B2Publication Date: 2014-03-04
- Inventor: Fujio Masuoka , Hiroki Nakamura
- Applicant: Fujio Masuoka , Hiroki Nakamura
- Applicant Address: SG Singapore
- Assignee: Unisantis Electronics Singapore Pte Ltd.
- Current Assignee: Unisantis Electronics Singapore Pte Ltd.
- Current Assignee Address: SG Singapore
- Agency: Brinks Gilson & Lione
- Main IPC: H01L31/18
- IPC: H01L31/18

Abstract:
It is an object to provide a CCD solid-state image sensor, in which an area of a read channel is reduced and a rate of a surface area of a light receiving portion (photodiode) to an area of one pixel is increased. There is provided a solid-state image sensor, including: a first conductive type semiconductor layer; a first conductive type pillar-shaped semiconductor layer formed on the first conductive type semiconductor layer; a second conductive type photoelectric conversion region formed on the top of the first conductive type pillar-shaped semiconductor layer, an electric charge amount of the photoelectric conversion region being changed by light; and a high-concentrated impurity region of the first conductive type formed on a surface of the second conductive type photoelectric conversion region, the impurity region being spaced apart from a top end of the first conductive type pillar-shaped semiconductor layer by a predetermined distance, wherein a transfer electrode is formed on the side of the first conductive type pillar-shaped semiconductor layer via a gate insulating film, a second conductive type CCD channel region is formed below the transfer electrode, and a read channel is formed in a region between the second conductive type photoelectric conversion region and the second conductive type CCD channel region.
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