Invention Grant
- Patent Title: Audio jack and electronic apparatus containing the same
- Patent Title (中): 音频插孔和包含它的电子设备
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Application No.: US13556600Application Date: 2012-07-24
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Publication No.: US08662937B2Publication Date: 2014-03-04
- Inventor: Xiyong Tian , Lingchang Li , Yinong Liu
- Applicant: Xiyong Tian , Lingchang Li , Yinong Liu
- Applicant Address: JP Tokyo SE Lund
- Assignee: Sony Corporation,Sony Mobile Communications AB
- Current Assignee: Sony Corporation,Sony Mobile Communications AB
- Current Assignee Address: JP Tokyo SE Lund
- Agency: Renner, Otto, Boisselle & Sklar, LLP
- Priority: CN201110214112 20110728
- Main IPC: H01R24/00
- IPC: H01R24/00

Abstract:
The present invention provides an audio jack and electronic apparatus containing the same. The audio jack includes a hollow insulated housing, wherein the insulated housing includes: a fixed portion and a rotating portion rotating relative to the fixed portion and on which at least two elastic terminals are arranged; and the at least two elastic terminals of the rotating portion being in contact with different pins of a printed circuit board of the audio jack respectively when the rotating portion is in a first position and rotates relative to the fixed portion to a second position. The audio jack and electronic apparatus containing the same of the present invention are applicable to the insertion of plugs of different specifications, increasing the range of application of the electronic apparatus on the premise of reducing the cost of the electronic apparatus.
Public/Granted literature
- US20130029535A1 AUDIO JACK AND ELECTRONIC APPARATUS CONTAINING THE SAME Public/Granted day:2013-01-31
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