Invention Grant
US08662875B2 Injection molding apparatus for shoe or sole using thermoplastic resin and thereby shoes
有权
用于鞋或鞋底的注塑设备使用热塑性树脂,从而鞋子
- Patent Title: Injection molding apparatus for shoe or sole using thermoplastic resin and thereby shoes
- Patent Title (中): 用于鞋或鞋底的注塑设备使用热塑性树脂,从而鞋子
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Application No.: US12816057Application Date: 2010-06-15
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Publication No.: US08662875B2Publication Date: 2014-03-04
- Inventor: Byoung Mun Lim , Jang Sik Yang , Si Hyeok Lee , In Chul Choi
- Applicant: Byoung Mun Lim , Jang Sik Yang , Si Hyeok Lee , In Chul Choi
- Applicant Address: KR Gimhae-Si, Gyeongsangnam-Do KR Busan
- Assignee: Comtech Chemical Co., Ltd.,Sung Shin New Material Co., Ltd.
- Current Assignee: Comtech Chemical Co., Ltd.,Sung Shin New Material Co., Ltd.
- Current Assignee Address: KR Gimhae-Si, Gyeongsangnam-Do KR Busan
- Agency: Lowe Hauptman & Ham, LLP
- Priority: KR10-2007-0138262 20071227
- Main IPC: B29C45/14
- IPC: B29C45/14 ; B29C45/16 ; B29C45/32 ; B29C44/04

Abstract:
Disclosed herein are an injection foam molding apparatus for manufacturing one-piece shoes or soles and one-piece shoes manufactured using the same. A thermoplastic resin is injected into top and bottom molds in a state in which the top and bottom molds are coupled with a middle mold and is then pressed to form the upper and lower parts of a shoe, the middle mold is separated therefrom, and then the top mold and bottom mold, including the upper part and lower part of the shoe, respectively, are pressed, thereby forming the upper part and lower part of the shoe into one body. The injection foam molding apparatus is advantageous in that, since functional one-piece shoes or soles, having various colors, hardnesses and specific gravities, and having excellent feeling and durability, can be manufactured using different materials by one apparatus, working time is decreased, and productivity can be increased.
Public/Granted literature
- US20100242312A1 INJECTION MOLDING APPARATUS FOR SHOE OR SOLE USING THERMOPLASTIC RESIN AND THEREBY SHOES Public/Granted day:2010-09-30
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