Invention Grant
- Patent Title: Fluid ejecting apparatus and fluid ejecting method
- Patent Title (中): 流体喷射装置和流体喷射方法
-
Application No.: US12833725Application Date: 2010-07-09
-
Publication No.: US08662637B2Publication Date: 2014-03-04
- Inventor: Bunji Ishimoto , Yumiko Takeda
- Applicant: Bunji Ishimoto , Yumiko Takeda
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Priority: JP2009-178779 20090731
- Main IPC: B41J2/21
- IPC: B41J2/21

Abstract:
A fluid ejecting apparatus includes first and second rows of nozzles ejecting first and second fluids respectively. A control section repeats an image formation operation ejecting fluid from the first and second nozzles while moving them perpendicularly to the row direction and controls transportation of the medium in the row direction. After formation of a first image layer by the first and second fluids, a second image layer is formed thereon by the second fluid. For normal image formation, the first and second nozzles forming the first image layer are further upstream in the row direction than the second nozzles forming the second image layer, and for image formation of an upper end of the medium, the first and second nozzles forming the first image layer are further downstream in the row direction than the first and second nozzles forming the first image layer in normal image formation.
Public/Granted literature
- US20110027490A1 Fluid Ejecting Apparatus and Fluid Ejecting Method Public/Granted day:2011-02-03
Information query
IPC分类: