A suction apparatus 1 holds a wafer W by performing vacuum-suctioning on the wafer W. The suction apparatus 1 comprises a suction substrate 2. The suction substrate 2, which is rigid, comprises a plurality of pin-like protrusions 2a formed so that the tip-end faces (upper surfaces) thereof are the same height. An elastic coating layer is coated by way of an undercoat layer 4 on the tip-end faces of the protrusions 2a. When the wafer W is suctioned, even if a foreign matter is interposed between the wafer W and the suction surface, because the foreign matter embeds itself into the coating layer 3, the planarization of the wafer W is improved. In addition, because the coating layer 3 can be made comparatively thinner, undulations in the wafer W can be reduced and, to that end, the planarization of the wafer W in the suctioned state can be improved.