Invention Grant
- Patent Title: Speaker module and electronic apparatus thereof
- Patent Title (中): 扬声器模块及其电子设备
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Application No.: US13361961Application Date: 2012-01-31
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Publication No.: US08654968B2Publication Date: 2014-02-18
- Inventor: Ching-Chia Mai , Kuan-Hsueh Tseng , Cheng-Han Lee , Chih-Ming Wang
- Applicant: Ching-Chia Mai , Kuan-Hsueh Tseng , Cheng-Han Lee , Chih-Ming Wang
- Applicant Address: TW Hsinchu Science Park, Hsinchu
- Assignee: Wistron NeWeb Corporation
- Current Assignee: Wistron NeWeb Corporation
- Current Assignee Address: TW Hsinchu Science Park, Hsinchu
- Agent Winston Hsu; Scott Margo
- Priority: TW100217682U 20110921
- Main IPC: H04M1/00
- IPC: H04M1/00

Abstract:
A speaker module for installing on an electronic device is disclosed. The speaker module includes a containing casing, a speaker device, an antenna, at least one audio signal transmitting member, and at least one antenna signal transmitting member. The containing casing has at least one hole formed thereon. The speaker device is disposed in the containing casing and outputs sound via the hole. The antenna is formed integrally with the containing casing along the contour of the containing casing. The audio signal transmitting member is electrically connected to the speaker device for electrically connecting to the electronic device, so as to establish audio signal transmission between the speaker device and the electronic device. The antenna signal transmitting member is electrically connected to the antenna for electrically connecting to the electronic device, so as to establish antenna signal transmission between the antenna and the electronic device.
Public/Granted literature
- US20130070952A1 SPEAKER MODULE AND ELECTRONIC APPARATUS THEREOF Public/Granted day:2013-03-21
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