Invention Grant
US08654540B2 Method for assembling at least one chip with a wire element, electronic chip with a deformable link element, fabrication method of a plurality of chips, and assembly of at least one chip with a wire element
有权
用于组装至少一个具有线元件的芯片的方法，具有可变形链接元件的电子芯片，多个芯片的制造方法，以及至少一个芯片与线元件
- Patent Title: Method for assembling at least one chip with a wire element, electronic chip with a deformable link element, fabrication method of a plurality of chips, and assembly of at least one chip with a wire element
- Patent Title (中): 用于组装至少一个具有线元件的芯片的方法，具有可变形链接元件的电子芯片，多个芯片的制造方法，以及至少一个芯片与线元件
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Application No.: US12977460Application Date: 2010-12-23
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Publication No.: US08654540B2Publication Date: 2014-02-18
- Inventor: Jean Brun , Dominique Vicard
- Applicant: Jean Brun , Dominique Vicard
- Applicant Address: FR Paris
- Assignee: Commisariat a l'Energie Atomique et aux Energies Alternatives
- Current Assignee: Commisariat a l'Energie Atomique et aux Energies Alternatives
- Current Assignee Address: FR Paris
- Agency: Oliff PLC
- Priority: FR0906333 20091223
- Main IPC: H05K7/00
- IPC: H05K7/00 ; H05K1/00 ; H05K1/03 ; H05K7/12 ; H01L21/00
Abstract:
A first step of the method for assembling a wire element with an electronic chip comprises arranging the wire element in a groove of the chip delineated by a first element and a second element, joined by a link element comprising a plastically deformable material, and a second step then comprises clamping the first and second elements to deform the link element until the wire element is secured in the groove.
Public/Granted literature
Information query
