Invention Grant
- Patent Title: Structure and design structure for high-Q value inductor and method of manufacturing the same
- Patent Title (中): 高Q值电感器的结构和设计结构及其制造方法
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Application No.: US13535412Application Date: 2012-06-28
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Publication No.: US08645898B2Publication Date: 2014-02-04
- Inventor: Hanyi Ding , Mete Erturk , Robert A. Groves , Zhong-Xiang He , Peter J. Lindgren , Anthony K. Stamper
- Applicant: Hanyi Ding , Mete Erturk , Robert A. Groves , Zhong-Xiang He , Peter J. Lindgren , Anthony K. Stamper
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Roberts Mlotkowski Safran & Cole, P.C.
- Agent Anthony Canale
- Main IPC: G06F17/50
- IPC: G06F17/50 ; H01L27/08

Abstract:
Structures with high-Q value inductors, design structure for high-Q value inductors and methods of fabricating such structures is disclosed herein. A method in a computer-aided design system for generating a functional design model of an inductor is also provided. The method includes: generating a functional representation of a plurality of vertical openings simultaneously formed in a substrate, wherein a first of the plurality of vertical openings is used as through silicon vias and is etched deeper than a second of the plurality of vertical openings used for high-Q inductors; generating a functional representation of a dielectric layer formed in the plurality of vertical openings; and generating a functional representation of a metal layer deposited on the dielectric layer in the plurality of vertical.
Public/Granted literature
- US20120267794A1 STRUCTURE AND DESIGN STRUCTURE FOR HIGH-Q VALUE INDUCTOR AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2012-10-25
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