A method reduces coupling noise and controls impedance discontinuity in ceramic packages by: providing at least one reference mesh layer; providing a plurality of signal trace layers, with each signal layer having one or more signal lines and the reference mesh layer being adjacent to one or more of the signal layers; disposing a plurality of vias through the at least one reference mesh layer, with each via providing a voltage (Vdd) power connection or a ground (Gnd) connection; selectively placing via-connected coplanar-type shield (VCS) lines relative to the signal lines, with a first VCS line extended along a first side of a first signal line and a second VCS line extended along a second, opposing side of said first signal line. Each of the VCS lines interconnect with and extend past one or more vias located within a directional path along which the VCS lines extends.