Invention Grant
- Patent Title: Interconnection techniques
- Patent Title (中): 互连技术
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Application No.: US13646872Application Date: 2012-10-08
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Publication No.: US08645804B2Publication Date: 2014-02-04
- Inventor: Ilango Ganga , Richard Mellitz
- Applicant: Ilango Ganga , Richard Mellitz
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agent Glen B Choi
- Main IPC: H03M13/00
- IPC: H03M13/00
Abstract:
Techniques are described that can be used to extend the data transmission rate specified by 10GBASE-KR of IEEE 802.3ap (2007) to more than 10 Gb/s using a multiple lane backplane. A signal for transmission over 10 Gb/s can be divided into multiple streams for transmission over multiple lanes. Multiple transceiver pairs can be used for transmission and receipt of the multiple streams. Each transceiver pair may comply with 10GBASE-KR of IEEE 802.3ap (2007).
Public/Granted literature
- US20130031445A1 INTERCONNECTION TECHNIQUES Public/Granted day:2013-01-31
Information query
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