Invention Grant
- Patent Title: Scan testing of integrated circuits and on-chip modules
- Patent Title (中): 集成电路和片上模块的扫描测试
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Application No.: US13530081Application Date: 2012-06-21
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Publication No.: US08645779B2Publication Date: 2014-02-04
- Inventor: Rajan Aggarwal , Ashutosh Anand , Ankit Bhargava , Mishika Singla , Prashant K. Sonone
- Applicant: Rajan Aggarwal , Ashutosh Anand , Ankit Bhargava , Mishika Singla , Prashant K. Sonone
- Applicant Address: US TX Austin
- Assignee: Freescale Semiconductor, Inc.
- Current Assignee: Freescale Semiconductor, Inc.
- Current Assignee Address: US TX Austin
- Agent Charles Bergere
- Main IPC: G01R31/28
- IPC: G01R31/28

Abstract:
A method for scan testing an integrated circuit that includes a plurality of on-chip logic modules includes configuring the integrated circuit for module level scan testing and chip level scan testing by way of an external automatic test pattern generator (ATPG) tool. The ATPG tool generates first and second sets of test patterns for module level and chip level scan testing of the integrated circuit. The ATPG tool generates the second set of test patterns by excluding the design faults which have already been targeted during the module level scan testing, from the first set of test patterns and reduces the overall time required for scan testing the integrated circuit.
Public/Granted literature
- US20130346819A1 SCAN TESTING OF INTEGRATED CIRCUITS AND ON-CHIP MODULES Public/Granted day:2013-12-26
Information query