Invention Grant
- Patent Title: Feedthrough assembly including electrical ground through feedthrough substrate
- Patent Title (中): 馈通组件,包括通过馈通基板的电接地
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Application No.: US13346424Application Date: 2012-01-09
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Publication No.: US08644936B2Publication Date: 2014-02-04
- Inventor: Rajesh V. Iyer , Simon E. Goldman , Thomas P. Miltich
- Applicant: Rajesh V. Iyer , Simon E. Goldman , Thomas P. Miltich
- Applicant Address: US MN Minneapolis
- Assignee: Medtronic, Inc.
- Current Assignee: Medtronic, Inc.
- Current Assignee Address: US MN Minneapolis
- Main IPC: A61N1/02
- IPC: A61N1/02

Abstract:
A feedthrough assembly may include a ferrule defining a ferrule opening, a capacitive filter array at least partially disposed within the ferrule opening, and a feedthrough at least partially disposed within the ferrule opening. In some examples, the capacitive filter array includes a filter array ground conductive pathway. In some examples, the feedthrough includes a feedthrough ground conductive via. The feedthrough ground conductive via may be electrically coupled to the filter array ground conductive pathway, and the feedthrough ground conductive via may be electrically coupled to the ferrule.
Public/Granted literature
- US20130176658A1 FEEDTHROUGH ASSEMBLY INCLUDING ELECTRICAL GROUND THROUGH FEEDTHROUGH SUBSTRATE Public/Granted day:2013-07-11
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