Invention Grant
- Patent Title: Seek scan probe (SSP) cantilever to mover wafer bond stop
- Patent Title (中): 寻求扫描探针（SSP）悬臂移动器晶圆键合停止
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Application No.: US12242843Application Date: 2008-09-30
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Publication No.: US08644125B2Publication Date: 2014-02-04
- Inventor: Tsung-Kuan Allen Chou , Nickolai Belov , John Heck
- Applicant: Tsung-Kuan Allen Chou , Nickolai Belov , John Heck
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Blakely, Sokoloff, Taylor & Zafman LLP
- Main IPC: H01L23/02
- IPC: H01L23/02 ; H01L23/31 ; H01L21/98
Abstract:
A seek-scan probe (SSP) memory involves multiple-wafer bonding needing precision small gaps in between. Solder reflow bonding is typically used to join the wafers due to its reliability and ability to hermetically seal. However, solder reflow bonding may not provide a consistently controllable gap due to flowing solder during the bonding process. Thus, a bond stop technique and process is used to provide accurate cantilever to media gap control.
Public/Granted literature
- US20130058202A1 SEEK SCAN PROBE (SSP) CANTILEVER TO MOVER WAFER BOND STOP Public/Granted day:2013-03-07
Information query
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