Invention Grant
- Patent Title: Semiconductor device having data bus
- Patent Title (中): 具有数据总线的半导体器件
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Application No.: US13303506Application Date: 2011-11-23
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Publication No.: US08644047B2Publication Date: 2014-02-04
- Inventor: Takamitsu Onda , Hisayuki Nagamine
- Applicant: Takamitsu Onda , Hisayuki Nagamine
- Agency: Young & Thompson
- Priority: JP2010-261431 20101124
- Main IPC: G11C7/02
- IPC: G11C7/02

Abstract:
A semiconductor device is disclosed which comprises a first wiring layer, a second wiring layer formed over the first wiring layer, data input/output terminals, and a data bus formed in the first and second wiring layers. The data bus includes N data lines transmitting data between a predetermined circuit and the input/output terminals. M first data lines among the N data lines have a length shorter than a predetermined length and residual N-M second data lines have a length longer than the predetermined length. Shield lines adjacent to the N data lines are formed in the first and second layers. The N data lines are arranged at positions at which the data lines do not overlap one another in a stacking direction of the first and second wiring layers.
Public/Granted literature
- US20120127773A1 SEMICONDUCTOR DEVICE HAVING DATA BUS Public/Granted day:2012-05-24
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