Invention Grant
- Patent Title: Semiconductor device and method of manufacturing a semiconductor device
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US13143762Application Date: 2009-11-23
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Publication No.: US08643121B2Publication Date: 2014-02-04
- Inventor: Markus Mueller , Raghunath Singanamalla
- Applicant: Markus Mueller , Raghunath Singanamalla
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: McClure, Qualey & Rodack, LLP
- Priority: EP09100027 20090112
- International Application: PCT/IB2009/055284 WO 20091123
- International Announcement: WO2010/079389 WO 20100715
- Main IPC: H01L21/70
- IPC: H01L21/70

Abstract:
A semiconductor device and a method of manufacturing a gate stack for such a semiconductor device. The device includes a gate stack that has a gate insulation layer provided over a channel region of the device, and a metal layer that is insulated from the channel region by the gate insulation layer. The metal layer contains work function modulating impurities which have a concentration profile that varies along a length of the metal layer from the source region to the drain region. The gate stack has a first effective work function in the vicinity of a source region and/or the drain region of the device and a second, different effective work function toward a center of the channel region.
Public/Granted literature
- US20110291206A1 Semiconductor Device and Method of Manufacturing a Semiconductor Device Public/Granted day:2011-12-01
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