Invention Grant
- Patent Title: Method for manufacturing epitaxial crystal substrate, epitaxial crystal substrate and semiconductor device
- Patent Title (中): 外延晶体基板,外延晶体基板和半导体器件的制造方法
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Application No.: US13574183Application Date: 2011-01-19
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Publication No.: US08643060B2Publication Date: 2014-02-04
- Inventor: Hajime Momoi , Koji Kakuta
- Applicant: Hajime Momoi , Koji Kakuta
- Applicant Address: JP Tokyo
- Assignee: JX Nippon Mining & Metals Corporation
- Current Assignee: JX Nippon Mining & Metals Corporation
- Current Assignee Address: JP Tokyo
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2010-010004 20100120
- International Application: PCT/JP2011/050806 WO 20110119
- International Announcement: WO2011/090040 WO 20110728
- Main IPC: H01L21/02
- IPC: H01L21/02 ; H01L21/20 ; H01L21/38 ; C30B25/00

Abstract:
Disclosed is a technology of manufacturing, at low cost, an epitaxial crystal substrate provided with a high-quality and uniform epitaxial layer, said technology being useful in the case of growing the epitaxial layer composed of a semiconductor having a lattice constant different from that of the substrate. The substrate, which is composed of a first compound semiconductor, and which has a step-terrace structure on the surface, is used, and on the surface of the substrate, a composition modulation layer composed of a second compound semiconductor is grown by step-flow, while changing the composition in the same terrace. Then, the epitaxial crystal substrate is manufactured by growing, on the composition modulation layer, the epitaxial layer composed of the third compound semiconductor having the lattice constant different from that of the first compound semiconductor.
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