Invention Grant
US08642891B2 Closure and interconnect systems and methods of using dry silicone gels in closure and interconnect systems
有权
封闭和互连系统以及在封闭和互连系统中使用干硅氧烷凝胶的方法
- Patent Title: Closure and interconnect systems and methods of using dry silicone gels in closure and interconnect systems
- Patent Title (中): 封闭和互连系统以及在封闭和互连系统中使用干硅氧烷凝胶的方法
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Application No.: US13164317Application Date: 2011-06-20
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Publication No.: US08642891B2Publication Date: 2014-02-04
- Inventor: Stephane J. G. Berghmans , Michael A. Oar , Miguel A. Morales , Gary W. Adams , Anne-Marie Prins , Nathalie Hendrickx , Guenter Feldmeier , Rudi Kraemer , Bert Bergner , Kristof Vastmans
- Applicant: Stephane J. G. Berghmans , Michael A. Oar , Miguel A. Morales , Gary W. Adams , Anne-Marie Prins , Nathalie Hendrickx , Guenter Feldmeier , Rudi Kraemer , Bert Bergner , Kristof Vastmans
- Applicant Address: DE Bensheim BM Kessel-Lo US PA Berwyn
- Assignee: Tyco Electronics AMP GmbH,Tyco Electronics Raychem BVBA,Tyco Electronics Corporation
- Current Assignee: Tyco Electronics AMP GmbH,Tyco Electronics Raychem BVBA,Tyco Electronics Corporation
- Current Assignee Address: DE Bensheim BM Kessel-Lo US PA Berwyn
- Agency: Brinks, Gilson & Lione
- Main IPC: H01B3/46
- IPC: H01B3/46 ; G02B6/255
Abstract:
Methods and systems are provided for a dry silicone gel in a closure or interconnect system. The dry silicone gel may be made by reacting a crosslinker, a chain extender, and a vinyl-terminated polydimethylsiloxane. The reaction may be conducted in the presence of a catalyst. In certain embodiments, the dry silicone gel may comprise: (1) a hardness between 100 g and 300 g, (2) a stress relaxation between 30% and 60% when subjected to a deformation of 50% of the original size of the gel, (3) a compression set between 4% and 20% after 50% strain has been applied to the gel for 1000 hours at 70° C., and/or (4) less than 10% oil bleed out under compression of 1.2 atm after 60 days at 60° C.
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