Invention Grant
- Patent Title: Thin film transistor structure, method of manufacturing the same, and electronic device
- Patent Title (中): 薄膜晶体管结构,制造方法及电子器件
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Application No.: US13869351Application Date: 2013-04-24
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Publication No.: US08642364B2Publication Date: 2014-02-04
- Inventor: Iwao Yagi , Hideki Ono , Mari Sasaki
- Applicant: Sony Corporation
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Wolf, Greenfield & Sacks, P.C.
- Priority: JP2010-037284 20100223
- Main IPC: H01L21/00
- IPC: H01L21/00

Abstract:
A high-performance thin film transistor structure which is easily manufactured is provided. The thin film transistor structure includes: a first electrode; second and third electrodes apart from each other in a hierarchical level different from that of the first electrode; first, second, and third wirings connected to the first, second, and third electrodes, respectively; a main stack body disposed so as to be opposed to the first electrode with an interlayer insulating layer in between, between the first electrode, and the second and third electrodes; and a sub stack body including an insulating layer and a semiconductor layer, disposed so as to be opposed to the first wiring with the interlayer insulating layer in between, between the first and second wirings in a position where the first and second wirings overlap and/or between the first and third wirings in a position where the first and third wirings overlap.
Public/Granted literature
- US20130237020A1 THIN FILM TRANSISTOR STRUCTURE, METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC DEVICE Public/Granted day:2013-09-12
Information query
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