Invention Grant
- Patent Title: Hinge device
- Patent Title (中): 铰链装置
-
Application No.: US13389865Application Date: 2009-11-16
-
Publication No.: US08640306B2Publication Date: 2014-02-04
- Inventor: Hideyuki Hirota
- Applicant: Hideyuki Hirota
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- International Application: PCT/JP2009/006111 WO 20091116
- International Announcement: WO2011/058615 WO 20110519
- Main IPC: E05D11/08
- IPC: E05D11/08 ; E05D11/10

Abstract:
A hinge device 100 includes: a one-piece hinge base 20 such that connecting hinge bases 21a, 21b in which rotational shaft portions 23a, 23b are protrusively provided in the same direction by a burring process are connected together through a hinge base connecting part 22; and a one-piece holder 10 such that connecting holders 11a, 11b having click washers 30a, 30b attached thereto are connected together through a holder connecting part 12, wherein the one-piece holder 10 is assembled to the one-piece hinge base 20 from one direction.
Public/Granted literature
- US20120137470A1 HINGE DEVICE Public/Granted day:2012-06-07
Information query