Invention Grant
- Patent Title: Semiconductor memory apparatus
- Patent Title (中): 半导体存储装置
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Application No.: US13162745Application Date: 2011-06-17
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Publication No.: US08526248B2Publication Date: 2013-09-03
- Inventor: Jeong Tae Hwang , Kang Youl Lee
- Applicant: Jeong Tae Hwang , Kang Youl Lee
- Applicant Address: KR Gyeonggi-do
- Assignee: SK Hynix Inc.
- Current Assignee: SK Hynix Inc.
- Current Assignee Address: KR Gyeonggi-do
- Agency: William Park & Associates Patent Ltd.
- Priority: KR10-2010-0131995 20101221
- Main IPC: G11C7/00
- IPC: G11C7/00
Abstract:
A semiconductor memory apparatus may include a bonding pad; a control signal pad; and an operation mode signal generation unit configured to generate a plurality of operation mode signals in response to a bonding signal inputted through the bonding pad and a control signal inputted through the control signal pad.
Public/Granted literature
- US20120155199A1 SEMICONDUCTOR MEMORY APPARATUS Public/Granted day:2012-06-21
Information query
