Invention Grant
- Patent Title: Feedthrough multilayer capacitor
- Patent Title (中): 馈通多层电容器
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Application No.: US13415431Application Date: 2012-03-08
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Publication No.: US08526162B2Publication Date: 2013-09-03
- Inventor: Masaaki Togashi , Takashi Aoki , Hiroshi Okuyama , Yutaro Kotani
- Applicant: Masaaki Togashi , Takashi Aoki , Hiroshi Okuyama , Yutaro Kotani
- Applicant Address: JP Tokyo
- Assignee: TDK Corporation
- Current Assignee: TDK Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oliff & Berridge, PLC
- Priority: JP2011-082877 20110404
- Main IPC: H01G4/35
- IPC: H01G4/35 ; H01G4/005

Abstract:
A conducting portion includes a plurality of conducting inner electrodes. Each of a pair of capacitance portions includes a plurality of signal inner electrodes while adjacently opposing each other in the laminating direction, a plurality of first grounding inner electrodes while adjacently opposing each other in the laminating direction, and a plurality of second grounding inner electrodes while adjacently opposing each other in the laminating direction. The plurality of first grounding inner electrodes are located between the conducting portion and the plurality of signal inner electrodes, while one of the first grounding inner electrodes adjacently opposes one of the first signal inner electrodes in the laminating direction. The plurality of second grounding inner electrodes are located between principal faces opposing each other in the laminating direction in the outer surface and the plurality of signal inner electrodes.
Public/Granted literature
- US20120250218A1 FEEDTHROUGH MULTILAYER CAPACITOR Public/Granted day:2012-10-04
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