Invention Grant
- Patent Title: Oxygen-barrier packaged surface mount device
- Patent Title (中): 氧隔离封装表面贴装装置
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Application No.: US12460349Application Date: 2009-07-17
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Publication No.: US08525635B2Publication Date: 2013-09-03
- Inventor: Luis A. Navarro , Josh H. Golden , Martyn A. Matthiesen
- Applicant: Luis A. Navarro , Josh H. Golden , Martyn A. Matthiesen
- Applicant Address: US PA Berwyn
- Assignee: Tyco Electronics Corporation
- Current Assignee: Tyco Electronics Corporation
- Current Assignee Address: US PA Berwyn
- Main IPC: H01C7/13
- IPC: H01C7/13

Abstract:
A method for producing a surface mount device includes providing a plurality of layers including a B-staged top layer and bottom layer, and a C-staged middle layer with an opening. A core device is inserted into the openings, and then the top and bottom layers are placed over and under, respectively, the middle layer. The layers are cured until the layers become C-staged. The core device is substantially surrounded by an oxygen-barrier material with an oxygen permeability of less than approximately 0.4 cm3·mm/m2·atm·day.
Public/Granted literature
- US08400255B2 Oxygen-barrier packaged surface mount device Public/Granted day:2013-03-19
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