Invention Grant
- Patent Title: Fusible substrate
- Patent Title (中): 易熔基材
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Application No.: US12425527Application Date: 2009-04-17
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Publication No.: US08525633B2Publication Date: 2013-09-03
- Inventor: Stephen J. Whitney , William Travis , Jeffrey P. Youngblood , Sarah M. Book , Edward D. Barriball , Milea J. Kittle
- Applicant: Stephen J. Whitney , William Travis , Jeffrey P. Youngblood , Sarah M. Book , Edward D. Barriball , Milea J. Kittle
- Applicant Address: US IL Chicago
- Assignee: Littelfuse, Inc.
- Current Assignee: Littelfuse, Inc.
- Current Assignee Address: US IL Chicago
- Agency: Kacvinsky Daisak PLLC
- Main IPC: H01H85/04
- IPC: H01H85/04 ; H01H85/00
Abstract:
A fuse element includes a substrate disposed between first and second terminals. The substrate includes an electrically insulative material. A conductive film is disposed on a first surface of the substrate and in electrical contact with the first terminal and second terminals.
Public/Granted literature
- US20100066477A1 FUSIBLE SUBSTRATE Public/Granted day:2010-03-18
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