Invention Grant
- Patent Title: Composite electronic module and method of manufacturing composite electronic module
- Patent Title (中): 复合电子模块及复合电子模块制造方法
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Application No.: US13239678Application Date: 2011-09-22
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Publication No.: US08525610B2Publication Date: 2013-09-03
- Inventor: Takatoshi Kato , Yasuhiro Takahashi
- Applicant: Takatoshi Kato , Yasuhiro Takahashi
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2010-215139 20100927
- Main IPC: H01P1/32
- IPC: H01P1/32

Abstract:
An electronic component is mounted on a substrate so as to be in contact with a non-reciprocal circuit element. Therefore, there is no risk of the electronic component, which is arranged so as to be in contact with the non-reciprocal circuit element, being displaced as a result of being shifted by the magnetic force of permanent magnets included in the non-reciprocal circuit element and displacement of the electronic component as a result of being shifted by the magnetic force of the permanent magnets can be prevented. Therefore, since there is no risk of the electronic component being displaced by being shifted by the magnetic force of the permanent magnets, a space in which to mount a member that would function as an electromagnetic shield, such as a yoke, need not be provided on the substrate and the composite electronic module can be reduced in size and profile.
Public/Granted literature
- US20120075032A1 COMPOSITE ELECTRONIC MODULE AND METHOD OF MANUFACTURING COMPOSITE ELECTRONIC MODULE Public/Granted day:2012-03-29
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