Invention Grant
US08525331B2 Chip design having integrated fuse and method for the production thereof
有权
具有集成保险丝的芯片设计及其制造方法
- Patent Title: Chip design having integrated fuse and method for the production thereof
- Patent Title (中): 具有集成保险丝的芯片设计及其制造方法
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Application No.: US13141687Application Date: 2009-11-23
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Publication No.: US08525331B2Publication Date: 2013-09-03
- Inventor: Karl Ilzer , Rainer Minixhofer , Mario Manninger
- Applicant: Karl Ilzer , Rainer Minixhofer , Mario Manninger
- Applicant Address: AT Unterpremstaetten
- Assignee: AMS AG
- Current Assignee: AMS AG
- Current Assignee Address: AT Unterpremstaetten
- Agency: McDermott Will & Emery LLP
- Priority: DE102008064428 20081222
- International Application: PCT/EP2009/065652 WO 20091123
- International Announcement: WO2010/072492 WO 20100701
- Main IPC: H01L23/48
- IPC: H01L23/48
Abstract:
A chip design (1) comprising an external supply connection (VBAT), an internal supply connection (VDD), an integrated circuit (2) that is coupled to the internal supply connection (VDD) for voltage supply, and a fuse (3) that electrically connects the internal supply connection (VBAT) and is arranged within the chip design (1).
Public/Granted literature
- US20120104605A1 Chip Design having Integrated Fuse and Method for the Production Thereof Public/Granted day:2012-05-03
Information query
IPC分类:
