Invention Grant
- Patent Title: Encapsulating package, printed circuit board, electronic device and method for manufacturing encapsulating package
- Patent Title (中): 封装封装，印刷电路板，电子器件和封装封装制造方法
-
Application No.: US13054251Application Date: 2009-01-28
-
Publication No.: US08525323B2Publication Date: 2013-09-03
- Inventor: Takao Yamazaki , Masahiko Sano , Seiji Kurashina , Yoshimichi Sogawa
- Applicant: Takao Yamazaki , Masahiko Sano , Seiji Kurashina , Yoshimichi Sogawa
- Applicant Address: JP Tokyo
- Assignee: NEC Corporation
- Current Assignee: NEC Corporation
- Current Assignee Address: JP Tokyo
- Priority: JPP2008-192342 20080725
- International Application: PCT/JP2009/051325 WO 20090128
- International Announcement: WO2010/010721 WO 20100128
- Main IPC: H01L23/12
- IPC: H01L23/12
Abstract:
The present invention is: a package main body section having a hollow section; and an electronic device provided in the hollow section in the package main body section, in the package main body section, there being formed a through hole, through which the hollow section communicates with outside of the package main body section, and in the through hole, there being provided a sealing section in which a vicinity of the through hole is partly heated and a constituent material of the package main body section is melted to thereby block the through hole.
Public/Granted literature
Information query
IPC分类:
