Invention Grant
- Patent Title: Printed substrate through which very strong currents can pass and corresponding production method
- Patent Title (中): 非常强的电流通过的印刷基板和相应的生产方法
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Application No.: US12513775Application Date: 2007-11-13
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Publication No.: US08525043B2Publication Date: 2013-09-03
- Inventor: Christian Delay
- Applicant: Christian Delay
- Applicant Address: NL Zwanenburg
- Assignee: AEG Power Solutions B.V., Dutch Company
- Current Assignee: AEG Power Solutions B.V., Dutch Company
- Current Assignee Address: NL Zwanenburg
- Agency: Sughrue Mion, PLLC
- Priority: FR0654887 20061114
- International Application: PCT/FR2007/052326 WO 20071113
- International Announcement: WO2008/059162 WO 20080522
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H05K7/00
Abstract:
On a printed circuit or substrate board (10) designed to receive electronic components and having conductive tracks (12) printed on said board, one or more conductive bars (18) are provided that are mounted one after another between conductive link surfaces (140, 142, 144), the conductive bars (18) being electrically interconnected during a subsequent soldering process that is either a wave soldering process or a soldering process in a reflow oven.
Public/Granted literature
- US20100025090A1 PRINTED SUBSTRATE THROUGH WHICH VERY STRONG CURRENTS CAN PASS AND CORRESPONDING PRODUCTION METHOD Public/Granted day:2010-02-04
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